2023 IEEE International Workshop on Electromagnetics:
Applications and Student Innovation Competition

July 15-18, 2023, Harbin, China

Organizing Committee

General Chair:
Qun Wu Harbin Institute of Technology, China

General Co-Chair:
Yingsong Li Anhui University, China

International Steering Committee
Chair:
Dau-Chyrh Chang
Asia Eastern University of Science and Technology

Co-Chairs:
Kwai-Man Luk City University of Hong Kong
Hiroyuki Arai Yokohama National University
Qing-Xin Chu
South China University of Technology

Members:
Kin-Fai(Kenneth) Tong University College London
Wen Shan Chen
Southern Taiwan University of Science and Technology
Kin-Lu Wong National Sun Yat-sen University
Kwok L. Chung Huizhou University
Kunio Sakakibara Nagoya Institute of Technology

TPC Chair:
Kuang Zhang Harbin Institute of Technology, China

TPC Co-Chairs:
Tao Jiang Harbin Engineering University, China
Junming Zhao Nanjing University, China
Yanhui Liu
University of Electronic Science and Technology of China
Hexiu Xu Air Force Engineering University, China

TPC Members:
Shah Nawaz Burokur
LEME, UPL, Univ Paris Nanterre, France
Ting-Yen Shih University of Idaho, U.S.
Xiaoming Chen Xi'an Jiaotong University, China
Wei Lin
The Hong Kong Polytechnic University, Hong Kong SAR China
Hui Li Dalian University of Technology, China
Xiaolong Wang Jilin University, China
Zongliang Zheng
Southwest Jiaotong University, China
Xunjun He
Harbin University of Science and Technology, China
Ming Fang Anhui University, China
Yue Wang Xi'an University of Technology, China
Naixing Feng Anhui University, China
Kaikun Niu Anhui University, China
Yueyi Yuan Harbin Institute of Technology, China

Conference Treasure:
Fanyi Meng Harbin Institute of Technology, China

Contact Information

Conference Secretary
Email: iwem2023@163.com

 

Paper online Submission

 

Registration Steps

Xiaoguang Liu

Biography: Prof. Xiaoguang “Leo” Liu received his Bachelor’s degree from Chu Kochen Honors College, Zhejiang University, in 2004 and PhD degree from Purdue University, USA, in 2010. He was with the Department of Electrical and Computer Engineering, University of California, Davis, as an assistant professor from 2011 to 2017 and an associate professor from 2017 to 2021. In Mar. 2021, he joined the School of Microelectronics (SME) at the Southern University of Science and Technology (SUSTech), Shenzhen, China, as a full professor.
At SUSTech, his research group is investigating various aspects of cutting-edge high-frequency and high-speed circuit and system designs. Examples include novel designs and implementation techniques in microelectronic and photonic devices such as micro-electromechanical (MEMS) devices, high-frequency (RF to THz) integrated circuits, high-speed wireline and optical communications, and high-resolution sensing applications using radar and computer vision principles. He has published over 130 refereed papers in academic journals and conferences. He has advised and co-advised 18 Ph.D. students and 7 postdoctoral scholars.

Title: High Efficiency Millimeter-wave Signal Generation and Future Prospects of Millimeter-wave Applications

Abstract:
In recent years, the millimeter-wave (mMW) and terahertz (THz) frequency bands (30 - 3000 GHz) has (re)emerged as a promising frequency spectrum for a variety of potential applications in wireless communications, remote sensing, security screening, industrial monitoring, biomedical and chemical spectroscopy, to name a few. The current enthusiasm in mmW/THz has largely been promoted by the rapid scaling of modern semiconductor integrated circuit processes, particularly CMOS and SiGe, which promise low barrier-to-entry mmW/THz systems. On the other hand, the aggressive scaling has generally resulted in a lower supply voltage and breakdown voltage, limiting the amount of power that can be generated. In this talk, we will review classical theories and present recent progress in our research group on state-of-the-art mmW/THz signal generation. In particular, we will demonstrate design and optimization strategies for high-efficiency oscillators working close to the maximum oscillation frequency FMAX of the underlying process with record-breaking power and efficiency performances. In addition, we will also discuss the application of these design techniques to high-speed chip-chip interconnect using micromachined dielectric waveguides.